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@PHDTHESIS{Behmenburg:210483,
author = {Behmenburg, Hannes},
othercontributors = {Heuken, Michael},
title = {{C}omprehensive study on {MOVPE} of {I}n{A}l{N}/{G}a{N}
{HEMT} structures and {G}a{N} nanowires},
address = {Aachen},
publisher = {Publikationsserver der RWTH Aachen University},
reportid = {RWTH-CONV-143614},
pages = {V, 155 S. : Ill., graph. Darst.},
year = {2013},
note = {Aachen, Techn. Hochsch., Diss., 2013},
abstract = {The use of InAlN as barrier layer material is considered as
promising idea to enhance the high frequency performance of
GaN-based High Electron Mobility Transistors (HEMT). In
comparison to the conventionally employed AlGaN, the
introduction InAlN allows the realization of a strain free
layer stack with enhanced carrier density in the
2-dimensional electron gas at simultaneously reduced barrier
layer thickness. The reduction of the barrier layer
thickness allows to realize short gate lengths and to
maintain a high aspect ratio of barrier layer thickness and
gate length. This is necessary to ensure control over
carriers in the transistor channel. Aim of this work is a
comprehensive study of the entire growth process of
InAlN/GaN HEMT structures on sapphire and SiC by
metalorganic vaporphase epitaxy (MOVPE). First, the
development of a GaN buffer structure on sapphire and SiC
suitable for high frequency operation is in the focus to
allow meaningful evaluation of improvement by introduction
of InAlN as new barrier layer material. Necessary properties
of this buffer are insulating behavior, a large breakdown
field, a low dislocation density and a low background
impurity level. It can be shown that the polar orientation
of the on sapphire employed AlN nucleation mainly depends on
the ratio of initially supplied precursors. Control of the
initial supply can be influenced by AlN residues in the
reactor chamber. Investigations of the AlN growth conditions
show that the development of tensile and compressive strain
depends on the V/III ratio employed. This is attributed to a
variation of the surface diffusion length of the Al adatom
and the associated growth mode. Sequential combination of
different V/III ratios can be used to control the state of
strain and the surface morphology allowing to deposit 500 nm
thick and crack-free AlN layers with a smooth surface. GaN
buffer structures deposited on the optimized AlN layer show
the required insulating properties, a large breakdown field,
a low dislocation density and a low impurity background
level. Investigations of the InAlN growth process show an
almost linear growth temperature dependency of In
incorporation. This allows accurate control of composition
and growth lattice matched to the GaN buffer. Unintentional
Ga incorporation in InAlN is detected and attributed to GaN
residues in the growth reactor. Modifications of the reactor
chamber almost completely eliminate the unintentional
incorporation of Ga in InAlN. Electrical characterization of
processed transistor structures yield excellent power
densities of 2,9 W/mm and 2,0 W/mm at 18 GHz and 40 Ghz,
respectively. Finally, the catalyst-assisted growth of GaN
nanowires on sapphire is investigated for the development of
future nanostructured devices. A process window is
described, which promotes the growth of 1-dimensional
structures leading to the formation of straight,
dislocation-free and N-polar nanowires with a diameter of 60
nm and a density of 3·109 cm-2. It can be shown that the
diameter of the nanowires is influenced by the diameter of
the catalyst the size of which is adjustable by the partial
pressure of the precursor material.},
keywords = {Drei-Fünf-Halbleiter (SWD) / Galliumnitrid (SWD) / HEMT
(SWD) / MOCVD-Verfahren (SWD)},
cin = {612020},
ddc = {620},
cid = {$I:(DE-82)612020_20140620$},
shelfmark = {85.30.Tv * 81.15.Kk * 73.61.Ey * 73.40.Kp * 68.55.-a *
61.05.cp},
typ = {PUB:(DE-HGF)11},
urn = {urn:nbn:de:hbz:82-opus-45422},
url = {https://publications.rwth-aachen.de/record/210483},
}