h1

h2

h3

h4

h5
h6
TY  - JOUR
AU  - Li, Ji
AU  - Gerhardy, Christof
AU  - Schomburg, Werner Karl
TI  - Polymer Circuit Boards Fabricated by Ultrasonic Hot Embossing
JO  - Journal of micromechanics and microengineering
VL  - 23
IS  - 7
SN  - 0960-1317
CY  - Bristol
PB  - IOP Publ. [u.a.]
M1  - RWTH-CONV-074355
SP  - 075028
PY  - 2013
LB  - PUB:(DE-HGF)16
UR  - <Go to ISI:>//WOS:000321063300037
DO  - DOI:10.1088/0960-1317/23/7/075028
UR  - https://publications.rwth-aachen.de/record/212171
ER  -