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@PHDTHESIS{Walch:794983,
author = {Walch, Emmanuel},
othercontributors = {Roos, Christian Hans-Georg and Rädlein, Edda},
title = {{I}nvestigation of the mechanical properties of a connector
- silver - enamel - float glass composite},
school = {Rheinisch-Westfälische Technische Hochschule Aachen},
type = {Dissertation},
address = {Aachen},
reportid = {RWTH-2020-08013},
pages = {1 Online-Ressource (XIV, 145 Seiten) : Illustrationen,
Diagramme},
year = {2020},
note = {Veröffentlicht auf dem Publikationsserver der RWTH Aachen
University; Dissertation, Rheinisch-Westfälische Technische
Hochschule Aachen, 2020},
abstract = {Heated automotive backlights are composed of the
soda-lime-silicates glass substrate, the enamel and silver
thick films, and several lead-free soldered connectors. The
challenges faced with this composite stack are significant
cumulated degradations of the initial glass strengths by the
subsequent addition of layers and connectors. SEM
fractographic analyses undertaken on the composite stack
have revealed that fracture originates in the enamel layer
and more precisely the region near the interface with
sintered silver. The soda-lime silicate glass and enamel
glass frit were found to have comparable values while the
fracture toughness of sintered silver has been found to be
one order of magnitude higher. The most critical defects of
the stack are located in the enamel, due to their relatively
large size, and the fragile nature of this layer.
Additionally, the amount of compressive residual stress in
the enamel film is lower compared to the surface of the
tempered glass substrate. Finally, the soldering of the
connector transfers tensile stresses in the brittle part of
the stack. Therefore, tensile stresses are applied to the
porosities present in the enamel. Theses porosities act as
stress concentrators, facilitating the propagation of cracks
which in turn decreases drastically the mechanical strength
of the composite stack. In the case of high tensile
soldering stresses, several cracks can propagate in the
enamel from pre-existing critical defects and propagates to
the glass, leading to the formation of glass chipping in the
glass substrate. The formation and growth of large glass
chips can lead to spontaneous breakage of the backlights.
The soldering process has the highest influences, among the
process parameter, onto the mechanical strength of the
composite stack. The robustness of the automotive backlight
can be increased by reducing the amount and size of
porosities in the enamel layer and by optimizing the
residual stresses in the stack.},
cin = {524210 / 520000},
ddc = {620},
cid = {$I:(DE-82)524210_20140620$ / $I:(DE-82)520000_20140620$},
typ = {PUB:(DE-HGF)11},
doi = {10.18154/RWTH-2020-08013},
url = {https://publications.rwth-aachen.de/record/794983},
}
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