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Influence of organic, film-like contaminants on ultrasonic metal welding of copper sheets and their in-situ detection
Helfers, E. (Corresponding author) ; Stockemer, O. ; Reisgen, U. ; Schiebahn, A. ; ; et al
Book of abstracts, 4th International Conference on Advanced Joining Processes 2025, Coimbra, Portugal, 16.-17.Oktober 2025, Seiten/Artikel-Nr: 150-156
Abstract/Contribution to a book/Contribution to a conference proceedings
2025
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