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Large-Scale Integration of 2D Material Heterostructures by Adhesive Bonding

; ; ; ; ; ; ; ;

In
MEMS 2020 : the 33rd IEEE International Conference on Micro Electro Mechanical Systems : Vancouver, Canada, January 18-22, 2020 / publisher: IEEE, Seiten/Artikel-Nr: 943-945

Konferenz/Event:33. International Conference on Micro Electro Mechanical Systems , Vancouver, BC , Canada , MEMS , 2020-01-18 - 2020-01-22

ImpressumPiscataway, NJ : IEEE

Umfang943-945

ISBN978-1-7281-3580-9, 978-1-7281-3581-6, 978-1-7281-3582-3

Datenträger: USB-Stick

Online
DOI: 10.1109/MEMS46641.2020.9056203


Einrichtungen

  1. Lehrstuhl für Elektronische Bauelemente (618710)
  2. AMICA - Advanced Microelectronic Center Aachen (052600)

Projekte

  1. ULISSES - Ultra low-power integrated optical sensor systems for networked environmental multichannel gas Sensing (825272) (825272)
  2. GrapheneCore2 - Graphene Flagship Core Project 2 (785219) (785219)
  3. FLAG-ERA II - The Flagship ERA-NET (730027) (730027)
  4. BMBF-03EFLNW199 - EXIST-Forschungstransfer : AachenCarbon (BMBF-03EFLNW199) (BMBF-03EFLNW199)


Dokumenttyp
Contribution to a book/Contribution to a conference proceedings

Format
online, print, data medium

Sprache
English

Anmerkung
Peer reviewed article

Externe Identnummern
SCOPUS: SCOPUS:2-s2.0-85083155437
WOS Core Collection: WOS:000569381600243

Interne Identnummern
RWTH-2020-10360
Datensatz-ID: 804537

Beteiligte Länder
Germany, Sweden

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The record appears in these collections:
Document types > Events > Contributions to a conference proceedings
Document types > Books > Contributions to a book
Faculty of Electrical Engineering and Information Technology (Fac.6)
Affiliated Institutes and Associations
Public records
Publications database
618710
052600
 Record created 2020-10-21, last modified 2025-10-21
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