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BMBF 16ME0399

Verbundprojekt: Neuro-inspirierte Technologien der künstlichen Intelligenz für die Elektronik der Zukunft - NEUROTEC II -

CoordinatorRheinisch-Westfälische Technische Hochschule Aachen - Fakultät 6 - Elektrotechnik und Informationstechnik - Institut für Werkstoffe der Elektrotechnik II
Grant period2021-11-15 - 2026-11-14
Funding bodyBundesministerium für Bildung und Forschung
 BMBF
Further information: Homepage
IdentifierG:(DE-82)BMBF-16ME0399

 

Recent Publications

All known publications ...
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http://join2-wiki.gsi.de/foswiki/pub/Main/Artwork/join2_logo100x88.png Preprint  ;  ;  ;  ;  ;  ;  ;  ;  ;  ;  ;  ;
Water-based, large-scale transfer of 2D materials grown on sapphire substrates
[10.21203/rs.3.rs-7544328/v1]  GO BibTeX | EndNote: XML, Text | RIS

http://join2-wiki.gsi.de/foswiki/pub/Main/Artwork/join2_logo100x88.png Abstract/Contribution to a book/Contribution to a conference proceedings  ;  ;  ;  ;  ;  ;  ;  ;
Volatile and Nonvolatile Resistive Switching in Wafer-Scale MoS2 Memristors
2025 Silicon Nanoelectronics Workshop : June 8-9, 2025, Rihga Royal Hotel Kyoto, Kyoto, Japan : workshop abstracts / AP, [the Japan Society of Applied Physics], Electron Devices Society ; general chair: Kuniyuki Kakushima (Institute of Science Tokyo)
2025 Silicon Nanoelectronics Workshop, SNW, KyotoKyoto, Japan, 8 Jun 2025 - 9 Jun 20252025-06-082025-06-09
[Piscataway, NJ] : IEEE 80-81 () [10.23919/SNW65111.2025.11097209]  GO BibTeX | EndNote: XML, Text | RIS

http://join2-wiki.gsi.de/foswiki/pub/Main/Artwork/join2_logo100x88.png Contribution to a book/Contribution to a conference proceedings  ;  ;  ;  ;  ;  ;  ;
Enhanced Threshold Switching Devices Based on Conductive Filaments in SiOx Through Vertically Aligned MoS2 Layers
Shaping the future with innovations in devices and manufacturing : the 9th IEEE Electron Devices Technology and Manufacturing Conference (EDTM 2025) : Hong Kong, China, 9-12 March 2025 / EDTM - Electron Devices Technology and Manufacturing Conference 2025 ; organized by: IEEE, Electron Devices Society
9. IEEE Electron Devices Technology & Manufacturing Conference, EDTM 2025, Hong KongHong Kong, Hong Kong, 9 Mar 2025 - 12 Mar 20252025-03-092025-03-12
[Piscataway, NJ] : IEEE () [10.1109/EDTM61175.2025.11041161]  GO BibTeX | EndNote: XML, Text | RIS

http://join2-wiki.gsi.de/foswiki/pub/Main/Artwork/join2_logo100x88.png Contribution to a book/Contribution to a conference proceedings  ;  ;  ;  ;
2D Materials for Neuromorphic Computing Devices
Shaping the future with innovations in devices and manufacturing : the 9th IEEE Electron Devices Technology and Manufacturing Conference (EDTM 2025) : Hong Kong, China, 9-12 March 2025 / EDTM - Electron Devices Technology and Manufacturing Conference 2025 ; organized by: IEEE, Electron Devices Society
9. IEEE Electron Devices Technology & Manufacturing Conference, EDTM 2025, Hong KongHong Kong, Hong Kong, 9 Mar 2025 - 12 Mar 20252025-03-092025-03-12
[Piscataway, NJ] : IEEE () [10.1109/EDTM61175.2025.11041583]  GO BibTeX | EndNote: XML, Text | RIS

http://join2-wiki.gsi.de/foswiki/pub/Main/Artwork/join2_logo100x88.png Journal Article  ;  ;  ;  ;  ;  ;
Unraveling the dynamics of conductive filaments in MoS2-based memristors by operando transmission electron microscopy
Nature Communications 16, 7433 () [10.1038/s41467-025-62592-2]  GO OpenAccess  Download fulltext Files BibTeX | EndNote: XML, Text | RIS

http://join2-wiki.gsi.de/foswiki/pub/Main/Artwork/join2_logo100x88.png Dissertation / PhD Thesis  ;  ;
Nanofabrication and device engineering solutions for improved resistive switching reliability
Aachen : RWTH Aachen University 1 Online-Ressource : Illustrationen () [10.18154/RWTH-2025-07435] = Dissertation, Rheinisch-Westfälische Technische Hochschule Aachen, 2025  GO OpenAccess  Download fulltext Files BibTeX | EndNote: XML, Text | RIS

http://join2-wiki.gsi.de/foswiki/pub/Main/Artwork/join2_logo100x88.png Dissertation / PhD Thesis  ;  ;
Memristive arrays for neuromorphic computing applications
Aachen : RWTH Aachen University 1 Online-Ressource : Illustrationen () [10.18154/RWTH-2025-07160] = Dissertation, Rheinisch-Westfälische Technische Hochschule Aachen, 2025  GO OpenAccess  Download fulltext Files BibTeX | EndNote: XML, Text | RIS

http://join2-wiki.gsi.de/foswiki/pub/Main/Artwork/join2_logo100x88.png Contribution to a book/Contribution to a conference proceedings  ;  ;  ;  ;
GUPA: Group-Wise Uniform Pruning Accelerator for Depthwise Separable Convolution
Proceedings for 2025 IEEE COOL Chips 28 : IEEE Symposium on Low-Power and High-Speed Chips and Systems : Takeda Hall, the University of Tokyo, Japan, April 16-18, 2025 / 2025 IEEE COOL Chips 28, Takeda Hall, the University of Tokyo, Japan, April 16-18, 2025 ; sponsored by the Technical Committees on Microprocessors and Microcomputers and Computer Architecture of the IEEE Computer Society, in cooperation with the IEICE Electronics Society and IPSJ ; IEEE ; organizing committee, chair: Fumio Arakawa, Univ. of Tokyo (Japan)
2025 IEEE Symposium on Low-Power and High-Speed Chips and Systems, COOL CHIPS, TokyoTokyo, Japan, 16 Apr 2025 - 18 Apr 20252025-04-162025-04-18
[Piscataway, NJ] : IEEE 6 Seiten () [10.1109/COOLCHIPS65488.2025.11018601]  GO  Download fulltext Files BibTeX | EndNote: XML, Text | RIS

http://join2-wiki.gsi.de/foswiki/pub/Main/Artwork/join2_logo100x88.png Journal Article  ;  ;  ;  ;  ;  ;  ;  ;  ;  ;
Influence of humidity on the resistive switching of hexagonal boron nitride-based memristors
npj 2D materials and applications 9(1), 41 () [10.1038/s41699-025-00566-0]  GO OpenAccess  Download fulltext Files BibTeX | EndNote: XML, Text | RIS

http://join2-wiki.gsi.de/foswiki/pub/Main/Artwork/join2_logo100x88.png Journal Article  ;  ;
3D kinetic Monte Carlo-based investigation of the influence of dopants on the reliability of VCM ReRAM
Journal of applied physics 137(17), 175105 () [10.1063/5.0262843]  GO OpenAccess  Download fulltext Files BibTeX | EndNote: XML, Text | RIS

All known publications ...
Download: BibTeX | EndNote XML,  Text | RIS | 


 Datensatz erzeugt am 2022-01-26, letzte Änderung am 2023-03-11


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