; ; ; ;
In
Proceedings for 2025 IEEE COOL Chips 28 : IEEE Symposium on Low-Power and High-Speed Chips and Systems : Takeda Hall, the University of Tokyo, Japan, April 16-18, 2025 / 2025 IEEE COOL Chips 28, Takeda Hall, the University of Tokyo, Japan, April 16-18, 2025 ; sponsored by the Technical Committees on Microprocessors and Microcomputers and Computer Architecture of the IEEE Computer Society, in cooperation with the IEICE Electronics Society and IPSJ ; IEEE ; organizing committee, chair: Fumio Arakawa, Univ. of Tokyo (Japan), Seiten/Artikel-Nr: 6 Seiten
2025
Online
DOI: 10.1109/COOLCHIPS65488.2025.11018601
URL: https://publications.rwth-aachen.de/record/1013042/files/1013042.pdf
Einrichtungen
Projekte
Restricted:
PDF
Dokumenttyp
Contribution to a book/Contribution to a conference proceedings
Format
online, print
Sprache
English
Anmerkung
Peer reviewed article
Externe Identnummern
SCOPUS: SCOPUS:2-s2.0-105008488954
Interne Identnummern
RWTH-2025-05303
Datensatz-ID: 1013042
Beteiligte Länder
Germany