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Grinding wheel wear and material removal mechanisms during grinding of polycrystalline diamond
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In
53rd CIRP Conference on Manufacturing Systems 2020 / Edited by Robert X. Gao, Kornel Ehmann
In
Procedia CIRP 93, Seiten/Artikel-Nr.:1520-1525
2020
Konferenzort: Chicago, IL, USA
Online
DOI: 10.18154/RWTH-2021-01371
DOI: 10.1016/j.procir.2020.03.083
URL: https://publications.rwth-aachen.de/record/811711/files/811711.pdf
Einrichtungen
- Werkzeugmaschinenlabor WZL der RWTH Aachen (417200)
- Lehrstuhl für Technologie der Fertigungsverfahren (417410)
Inhaltliche Beschreibung (Schlagwörter)
Grinding Wheel Wea (frei) ; Material Removal Mechanisms (frei) ; Polycrystalline Diamond (frei) ; SCHLTF100 (frei)
Thematische Einordnung (Klassifikation)
DDC: 670
OpenAccess: 
PDF
Dokumenttyp
Journal Article/Contribution to a conference proceedings
Format
online
Sprache
English
Anmerkung
Peer reviewed article
Externe Identnummern
SCOPUS: SCOPUS:2-s2.0-85098715412
Interne Identnummern
RWTH-2021-01371
Datensatz-ID: 811711
Beteiligte Länder
Germany
Related:
Journal Article/Contribution to a book/Contribution to a conference proceedings
Grinding wheel wear and material removal mechanisms during grinding of polycrystalline diamond
53. CIRP Conference on Manufacturing Systems, CIRP CMS 2020, onlineonline, 1 Jul 2020 - 3 Jul 2020
Procedia CIRP 93, 1520-1525 (2020) special issue: "53rd CIRP Conference on Manufacturing Systems 2020 / Edited by Robert X. Gao, Kornel Ehmann" (9781713818809)
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