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Graphene-based Wireless Agile Interconnects for Massive Heterogeneous Multi-chip Processors

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In
IEEE wireless communications 30(4), Seiten/Artikel-Nr.:162-169

ImpressumNew York, NY : IEEE

ISSN1558-0687

Online
DOI: 10.1109/MWC.010.2100561


Einrichtungen

  1. Lehrstuhl für Elektronische Bauelemente (618710)
  2. Lehrstuhl für Höchstfrequenzelektronik (618510)

Projekte

  1. WiPLASH - Architecting More Than Moore – Wireless Plasticity for Heterogeneous Massive Computer Architectures (863337) (863337)
  2. 2D-EPL - Graphene Flagship 2D Experimental Pilot Line (952792) (952792)
  3. GrapheneCore3 - Graphene Flagship Core Project 3 (881603) (881603)
  4. COMPUSAPIEN - Computing Server Architecture with Joint Power and Cooling Integration at the Nanoscale (725657) (725657)
  5. PROJESTOR - PROJECTED MEMRISTOR: A nanoscale device for cognitive computing (682675) (682675)
  6. GIMMIK : Graphenprozessierung auf 200mm Wafern für mikroelektronische Anwendungen (BMBF-03XP0210F) (BMBF-03XP0210F)

Thematische Einordnung (Klassifikation)
DDC: 004


Dokumenttyp
Journal Article

Format
online, print

Sprache
English

Anmerkung
Peer reviewed article

Externe Identnummern
SCOPUS: SCOPUS:2-s2.0-85136115912
WOS Core Collection: WOS:001109146400017

Interne Identnummern
RWTH-2023-03829
Datensatz-ID: 955946

Beteiligte Länder
Germany, Italy, Spain, Switzerland

 GO


Related:

http://join2-wiki.gsi.de/foswiki/pub/Main/Artwork/join2_logo100x88.png Preprint  ;  ;  ;  ;  ;  ;  ;  ;  ;  ;  ;  ;  ;  ;  ;  ;  ;  ;  ;  ;
Graphene-based Wireless Agile Interconnects for Massive Heterogeneous Multi-chip Processors
[10.48550/arXiv.2011.04107]  GO arXiv   Download fulltextFulltext by arXiv.org BibTeX | EndNote: XML, Text | RIS


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Faculty of Electrical Engineering and Information Technology (Fac.6)
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618510
618710

 Record created 2023-04-11, last modified 2024-07-15



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