; ;
In
2023 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) : SISPAD 2023 : September 27-29, 2023, Kobe Chamber of Commerce and Industry, Kobe, Japan / conference chair: S. Souma (Kobe Univ.) ; publication: Y. Kamakura (Osaka Inst. Technol.), Seiten/Artikel-Nr: 269-272
2023
Online
DOI: 10.23919/SISPAD57422.2023.10319613
Einrichtungen
Dokumenttyp
Contribution to a book/Contribution to a conference proceedings
Format
online, print
Sprache
English
Anmerkung
Peer reviewed article
Externe Identnummern
SCOPUS: SCOPUS:2-s2.0-85179122449
WOS Core Collection: WOS:001117703800067
Interne Identnummern
RWTH-2023-11069
Datensatz-ID: 973902
Beteiligte Länder
Germany